damascene
damascene
1. Evaluation of microstructure and stress of Cu damascene interconnects using AFM and SNAM
Cu互连线显微结构和应力的AFM及SNAM分析(英文)
2. Cu Damascene interconnects
Cu大马士革互连
3. Dual Damascene Cu is being used to replace Al-Cu metal lines and W vias & plugs.
Cu已经被用来替代Al-Cu合金连线和W 塞，因为与铝相比，Cu有较高的导电率与较强的抗迁移能力。
4. In order to solve the problem, many countries have already developed the damascene manufacturing method and used the copper metallization to replace the traditional aluminum metallization.
为解决互连延迟带来的危机,国际上已开发出以铜为互连材料,大马士革工艺为制造方法的铜互连工艺以取代亚微米时代的铝互连工艺.
5. The new CMP3200TM alumina slurry which meets the 110nm technology node for tungsten CMP on damascene and plug layers has been introduced.
介绍了用于钨双嵌入和钨栓CMP工艺的新型CMP3200TM氧化铝浆料,测试证明,这种浆料在110nm技术节点的钨CMP工艺应用中取得了理想的效果。
6. Dual damascene technology of Cu/ low dielectric layer is introduced in this paper, andthis technology has been used in manufacturing DRAM and logic devices.
介绍了铜/介电常数介电层的双嵌入式工艺,该工艺已大规模应用于动态记忆存储器(RAM)逻辑电路器件中。
7. Dual damascene technology of Cu / low dielectric layer is introduced in this paper, andthis technology has been used in manufacturing DRAM and logic devices.
介绍了铜/低介电常数介电层的双嵌入式工艺,该工艺已大规模应用于动态记忆存储器(DRAM)和逻辑电路器件中。
8. The traditional Al metallization could not meet the requirements for the development of interconnect technology. Developing damascene Cu metallization has become the main trend recently for the interconnect technology.
传统的Al金属互连技术已经不能满足现代互连技术发展的需要 ,大马士革结构的Cu金属互连技术已成为互连技术的重点发展方向之一。
9. dual damascene
双大马士革
10. Copper/low k dual damascene processLI
双嵌入式低k介电层/铜工艺技术
11. dual damascene process
双嵌入（双大马士革）工艺
12. Damascene War
大马士革战争(公元前280-前279)
13. Rosa damascene
大马士革蔷薇
14. Damascene steel
大马士革钢
15. Damascene copper interconnection
大马士革铜互连线
16. Damascene inlayed fabric
大马士革镶嵌结构
17. The results indicate the stress of copper interconnects generates in the metallization and the thermal stress caused by thermal mismatch during the Damascene process is the main stress.
对测量结果的分析得出金属薄膜的淀积是造成铜互连线中应力的主要原因，热应力在铜互连线应力中占较大比例，热处理后铜互连线中应力减小。
18. Also,the article points out all the conditions for industrialization of Rosa damascene tyigintipetala in Panxi area,a potential industrialization scale with co...
我国也是玫瑰的栽培区，但由于品种差异、工艺技术落后，玫瑰精油不能出口，国内市场也一直依赖进口。
19. Hence Damascene says (De Fide Orth. iii, 4) that "Christ Who God and Man, is called created and uncreated, passible and impassible.
故此，达马辛（Damascene）说“是神又是人的基督，称为受造而非受造的，能受苦且不能受苦的。”
20. This paper introduces basic technology of copper interconnect, including single and dual damascene technology, CMP technology, low k dielectric materials, barrier materials and reliability of copper interconnect.
文中介绍了基本的铜互连布线技术 ,包括单、双镶嵌工艺 ,CMP工艺 ,低介电常数材料和阻挡层材料 ,及铜互连布线的可靠性问题
21. The Study of FSG Etching in Non-Stop Layer Dual Damascene Structure
无中间层双大马士革中FSG刻蚀技术研究
22. No one is expecting Beijing's negotiators to undergo a Damascene conversion during the late nights of cajoling and compromise in Copenhagen.
没有人指望北京谈判代表在哥本哈根那充斥着利诱和妥协的深夜经历质的转变。
23. A Cost Effective, Low-defect Tungsten CMP Slurry for Advanced Damascene and Plugs Processes
用于先进的双嵌入和栓工艺的低缺陷钨CMP高性价比浆料(英文)
24. Plasma-induced damage on 90nm Cu dual Damascene technology devices is investigated.
研究了等离子体工艺对90nm铜大马士革工艺器件的损伤.
25. English society did not undergo a Damascene conversion.Instead, it survived a period of intense confusion, debate, self-analysis and self-deception.
英国社会并没有经历大马士革式的转变，相反，它历经了极度混乱、争论、自我剖析和自我欺骗的时期而幸存下来。
26. In this paper, the Damascene Cu interconnecting integration technology, low-k dielectric materials and barrier materials in Cu interconnecting integration technology are introduced.
论述了铜互连技术中低k介质材料、势垒层材料以及铜互连布线的大马士革工艺.
27. silk damascene
达马西恩缎
28. And various kinds of cultivation techniques for Rosa damascene tyigintipetala are discussed in the article.
近年来，由于主产国政治经济以及技术、成本等多方面的原因，产量大幅下降，市场缺口很大。
29. Recently, copper electroplating also becomes an important process step for IC device manufacture due to the requirement of Dual Damascene process of copper interconnection.
近日来，对IC元件制造而言，由于金属铜内连接双镶嵌制程的需求，电镀铜也已经变成一项重要制程步骤。
30. This truly is a Damascene conversion.
这确实是一次质的转变。
31. Application of Copper Interconnect and Damascene Technology in Deep Submicron IC
铜互连布线及其镶嵌技术在深亚微米IC工艺中的应用
32. Cu electrodeposition is one of the most important technologies in the Damascene fabrication of interconnects.
铜电沉积是互连“大马士革”( Damascene)工艺中最为重要的技术之一。
