micropackage

micropackage

1. Because the micropackage essentially is the same size as the silicon die, there is no significant encapsulation for protection.

因为微型封装器件实际上与硅芯片尺寸相同，没有有效的封装进行保护。

2. Therefore, if a profile for a standard package is used on a micropackage, the component will become super heated.

因此，如果在微型封装上采用标准封装的温度曲线，微型封装器件将过热。

3. The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。