reflow

reflow

1. After reflow soldering and restored at room temperature, they meet the characteristics listed below.

經過回流焊並冷卻至室溫後，電容器的特性符合下表的要求。

2. 49 Jones SM, Thurman RG. L-arginine minimizes reperfusion injury in a low-flow, reflow model of liver perfusion.

48陈玺华,李正中,鲍民生,郑绘霞.一氧化氮在大鼠肝缺血再灌注损伤中的作用.世界华人消化杂志,1999;7:295-297

3. Deposition of CVD BPSG Films and Its Reflow Mechanism

CVD BPSG膜的沉积及其回流机理

4. The lead-free alloys used in EnviroMark 907 are made using proprietary technology that optimizes the performance of paste for printing and reflow operations.

EnviroMark 907中使用的无铅合金是通过专利技术制造出来的,它使锡膏具有了最佳的印刷和回流操作性能。

5. FL250D is designed for maximum performance in stencil printing and reflow profiling, with the capability of printing up to eight inches per second with squeegees or within an enclosed head.

FL250D在模板印刷和设定回流温度特性曲线中可以展现出最佳性能,使用橡胶辊轴或使用封闭印刷头可以达到每秒8英寸的印刷能力。

6. The most severe apoptosis occurred in tubular epithelial cells of both young and aged mice at day 7 after reflow (P < 0.05).

IRI1d后出现肾小管上皮细胞凋亡,7d凋亡达到高峰(P<0.05),且在同一时间点,高龄鼠比低龄鼠严重(P<0.05)。

7. The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created.

NMP的目的是为了减少烘烤的水量从塑料包装事先焊。由于水蒸发吸收的回流，可能会产生内部裂纹和失败。

8. Discoloration of OSP on PCB Surface after Reflow Soldering

OSP板件回流焊后变色的探讨

9. R520A lead-free solder paste has exceptional thixotropic properties and the reduction in viscosity loss during printing cycles prevents bridging before and during reflow.

R520A无铅焊锡膏具有优越的触变特性,降低了印刷期间的粘性衰减,防止了回流前和回流期间桥接的出现。

10. Design of Temperature Instrument of Reflow Soldering in SMT

SMT回流焊温度测试仪的设计

11. Setting the Parameters of the Reflow Oven in the Process of SMT

SMT组装工艺中回流焊工作温度参数的确定

12. reflow of capital

[经] 资本回流

13. Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering.

“竖碑”现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。

14. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation.

一旦被确认，SMD可被适当的包装、贮存和处理已避免在组装过程中的回流和/或返修中的热和机械损伤。

15. A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.

一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。

16. Following is a summary of common reflow problems that may be encountered with the RTS reflow profile and the remedies by which to resolve them.

下面是在用RTS曲线过程中会碰到的一些普遍问题的总结和相应的处理对策。

17. Do not inhale the vapor during reflow.

不要吸入回流焊时喷出的蒸气。

18. , Ltd)has been engaged in development, produce and sales of industry automatic lining, wave soldering, reflow soldering, SMT-related device and ware device.

主要从事工业自动化流水线、波峰焊、回流焊、SMT周边设备、仓储物流及周边设备的研制、、开发、生产和销售。

19. This article expounds the future development of reflow soldering technology according to the changes of technology in SMT.

主要针对SMT技术发生的巨大变化,对再流焊技术未来发展进行了简单的阐述。

20. Products are mainly Mounter automatically sent (received) board machine, reflow, feeder machine, wave soldering, production lines and a variety of related electronic equipment;

产品主要有贴片机、自动送（收）板机、回流焊、接驳机、波峰焊、生产线以及各种相关的电子设备；

21. Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.

产品回焊后在残留的助焊剂周边会有大量小的锡球。

22. Product Performance.Since flux serves multiple functions for reflow and wavesolder applications, the ingredients must be considered from a cleaning perspective.

产品性能：焊剂在再流焊和波峰焊应用中具有多种功能，因此必须从清洗的角度对焊剂成分予以考虑。

23. Today, automatic software for the reflow oven can, within seconds, identify millions of alternative oven recipes and choose the single most optimal configuration.

今天，用于再流炉的自动化软件几秒钟内就能识别上百万种可选择的参数设置方案，并从中选出最佳配置。

24. Introducing the general technology requirements for reflow soldering and typical temperature profile and technical parameter of the main control point at the temperature profile.

介绍了再流焊机的一般技术要求，并给出了典型焊接温度曲线以及温度曲线上主要控制点的工艺参数。

25. Through-hole reflow is a new concept of the contemporary assembly technolog y.

介绍了通孔回流焊的概念、特点、分类和使用工艺要点。

26. Process Considerations for the Optimization of a Reflow Profile

优化回流特性温度曲线时的流程考虑

27. However, when a device is to be reused, a removal profile similar to the installation profile or the installation profile itself should be used for reflow.

但是，如果器件需重复使用，拆除温度曲线就要类似于组装温度曲线，而组装温度曲线本身应该是用于再流焊的。

28. Miniature and light weight. Suit for reflow and wave flow solder. Stable electrical capability, high reliability. Low assembly cost, suit for automatic SMT equipment. Superior mechanical and frequency characteristics.

体积小、重量轻。适应再流焊与波峰焊。电性能稳定,可靠性高。装配成本低,并与自动装贴设备匹配。机械强度高、高频特性优越。

29. Solder balling test in air and nitrogen using a typical reflow thermal profile

使用一个典型焊料温度特性曲线在空气和氮气中进行焊料成球测试

30. 1 Is the Reflow technology in use suitable for the product being built? Must be full forced Convection with sufficient zone count.

使用的回流焊技术是否适于正在生产的产品?必须是有充分区域数的全强制对流.

31. An example is a pre-reflow misaligned chip component.This component may or may not self-align in the reflow oven.

例如，再流前对准不良的片式元件，这种元件在再流炉中可能会自对准，也可能不会。

32. I am always working at the electric and hydrosphere facilities, and I am familiar to the setting flow of nitrogen Lead-Free Reflow Welding Soldering Oven.

先后在车间的电气与水气部门工作，熟悉了氮气高速无铅回流焊炉的组装流程；

33. Development of advanced electronic package devices promoted the study on the reflow soldering.

先进电子封装器件的出现推动了再流焊方法和设备的研究。

34. No cleaning; Excellent print consistency; Clear, transparent color residues; Excellent solder voiding resistance; Wide reflow window; Excellent wettability.

免洗；卓越的印刷性能；残留颜色透明；空洞少；宽的回流窗口；极好的润湿能力。

35. The main products: silk screen machines, Dianjiao Ji, Mounter, reflow, wave soldering SMT-related tools and supplies.

公司主要经营：丝印机、点胶机、贴片机、回流焊、波峰焊及SMT相关工具耗材。

36. A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.

关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。

37. Keywords soldering reflow;wave-soldering;manual soldering;

关键词回流焊;波峰焊;手工焊接;

38. Keywords: PCB； fiducial sign;through hole;wave soldering; reflow soldering;design for testability

关键词：印制电路板；基准标志；导通孔；波峰焊；再流焊；可测性设计

39. reflow coating

再流平涂料

40. Obtaining and Controlling Reflow Oven Cooling Rates

再流焊冷却区之设置及控制

41. Statistical Process Control of Reflow Soldering

再流焊工艺的统计过程控制

42. General Technology Requirements for Reflow Soldering and Test Way of Temperature Profile

再流焊接的一般要求及温度曲线测试方法

43. Automatic Management System of Solder Joint Reliability in Reflow Soldering

再流焊焊点可靠性自动管理系统

44. Peak soldering reflow temperature also impacts cleaning performance.

再流焊的峰值温度也会对清洗性能造成影响。

45. The Formation and Prevention of the Soldering Balls at Reflow Soldering

再流焊锡珠的形成与预防

46. reflow damage

再流通损害

47. Intracoronary bivalirudin for no reflow reversal: a second chance to treat this disorder?

冠脉内给予比伐卢定，治疗无再流的第二个选择？

48. Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.

凯斯特骄傲地宣布,它已获得回流密封剂技术(其中包括材料和使用方法)的专利。

49. The reasons of reflow discoloration of tin deposit on connector were analyzed.

分析了连接器锡镀层发生回流变色的原因。

50. Pin-through-hole Reflow Soldering Technology for Single-sided Board

单面电路板通孔再流焊接技术

51. Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏。

52. Refer to related JEDEC standards, some issues for plastic IC - such as moisture sensitive level, packing requirements, SMT reflow profile and reworking - are introduced and discussed.

参考JEDEC标准,介绍和讨论塑封IC器件的潮敏问题,如潮敏分级,相应的包装要求,SMT回流焊温度曲线等。

53. dual reflow

双重回焊

54. Pin-testable flux residues remain soft after reflow and will be pin-testable, the flux is designed not to harden at the higher peak temperatures.

可探针测试残留物回流后依然保持柔软状态,因而可以使用探针测试,该种焊剂在较高的峰值温度下不会变硬。

55. Excellent in solderability and high heat resistance with either flow or reflow soklering.

可焊性和耐焊性优,适用于流焊和再流焊。

56. At the same time,experiments on PBGA solder ball laser reflow were carried out.

同时，本文还对PBGA钎料球激光重熔进行了试验研究。

57. reflow discoloration

回流变色

58. Should a nitrogen atmosphere be used in the reflow process?

回流工艺中是否应使用氮气?

59. reflow's cycle

回流次数

60. reflow rotio

回流比

61. reflow ammonia

回流氨

62. reflow sputter

回流溅射

63. Set of temperature deal Curve in reflow oven

回流炉温度分布曲线的设定

64. Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.

回流焊:应用加热金属涂敷层的表面和预涂焊膏,熔融,连接和凝固两个金属涂层。

65. reflow process

回流焊工艺

66. reflow soldering

回流焊接

67. Reflow Oven

回流焊炉

68. 1 Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?

回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?

69. reflow factor

回流系数

70. reflow melting

回流融化

71. Reflow solder

回流过程

72. The reflow process relies on the temperature profile setting.

回流过程依赖于温度曲线的设定。

73. reflow soldering oven

回流锡焊炉

74. Figure 1. When using a VOS for alignment, it is desirable to have a fixed location for the component to be picked up by the vacuum nozzle within the reflow head.

图1.当采用视觉叠层系统（VOS）进行对准时，在再流焊头里有一个固定位置通过真空吸嘴拾取元器件，是再理想不过了。

75. Figure 4. Potential locations for inspection prior to reflow in a typical SMT line. There is an increase in cost per defect as the part moves further down the line.

图4在典型SMT组装线上，再流前是进行检测的可能工位，随着组件进一步移动到下线，每个缺陷的成本在增加。

76. A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.

在迴焊过程中,因BGA锡球内孔隙有气体溢出而形成吹孔.

77. In SMT reflow soldering process,profiling a PCBA is a extremely important step.

在SMT回流焊的整个流程中，为组装电路板设定合适的温度分布曲线是十分重要的一个环节。

78. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.

在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。

79. In the reflow process, this means monitoring the thermal profile of every production board.

在再流工艺控制中，这意味着要对制造的每块板子的热曲线进行监控。

80. In the course of the lead free reflow soldering,lead and Lead free of reflow soldering affect the quality of product.

在再流焊无铅化过程中,再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。