solder
solder
1. The 1710 series threaded and solder end range are "T" pattern globe style valves.
1710系列螺纹和焊接连接端口为T形截止阀结构的阀门。
2. More than 3 years working experiences in SMT processing and strong willing to be a technical sales in selling lead-free solder paste.
3年以上SMT生产线工艺制程控制经验,具有销售无铅锡膏产品的愿望。
3. Solder side is chosen to measure.
4量测以吃锡面为选择点。
4. More than 5 years working experiences in SMT process. Familiar with technical, equipment, process of lead-free solder paste.
5年以上SMT锡膏制程工作背景,熟悉无铅锡膏产品技术及生产工艺、设备、制程者。
5. BGA measurement is measured for inside solder point.
BGA量测以最内侧焊点为量测依据。
6. FCT Solder’s site provides detailed information about SN100C and its applications.
FCT焊料的网站提供详细资料，实绩及其应用。
7. Q: Will IPC be publishing a new specification for inspection of lead-free solder joints?
IPC是否会颁布新的关于无铅焊接的质检标准?
8. Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester.
Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。
9. Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester.
Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。
10. RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste.
RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。
11. TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable.
TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
12. TCS-531-1 uses fine solder powder and its flux system exhibits high reliability with high insulation and corrosion resistance.
TCS-531-1使用了精细焊料粉,其焊剂配系具有很高的可靠性,同时具有很高的绝缘和抗腐蚀能力。
13. A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.
一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。
14. SMOBC: Solder mask over bare copper.
一种阻焊层覆盖裸铜的工艺。
15. Type of high density solder mask.
一种高密度焊料掩膜。
16. Generally the same fluxes will work for lead-free solder.
一般来说,相同的焊剂用于无铅焊料是有效的。
17. Generally, solder alloys with more than about 8% bismuth will be brittle.
一般来说,铋含量超过8%的焊料合金将会变脆。
18. Not all MCMs have Solder Balls or Leads to realize electrical connecting.
不是所有的MCM都采用焊球或引脚和外界相连。
19. Do not solder directly to cells or batteries.
不要直接对电池进行焊接。
20. The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.
不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。
21. Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched.
丝印模板,锡浆网,胶水网
22. To ensure good wetting and low voiding I believe I will pre clean and etch the solder (prefrom) to remove oxides.
为了保证良好的润湿性及低空洞率，我认为需要进行预清洗，并对焊片表面进行刻蚀以去除氧化物。
23. To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
24. Solder end valves also available.
也可以提供焊接连接端口的阀门。
25. The amount of refund tax should be consult with the solder .
买单公司的退税金额应该和卖单企业商议。
26. Gong Yoo who was enlisted as active solder in January is now serving as entertainment soldier.
于一月现役入伍服役的孔刘，现在正以艺能兵的身分服役中。
27. So it will result in rigidity skin &block and solder balls etc.
产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。
28. However, in the eutectic SnBi solder joints, the constituted elements are Sn and Bi.
但是，在共晶锡铋焊点中，组成的元素为锡和铋而非单一元素。
29. Very low leakage current, compact, easy to use power entry filter with fast on tabs or solder terminals.
低漏电流,小巧,端子嵌入或焊锡,方便安装和使用。
30. All electronics assemblies using lead in solder.
使用含铅焊料的所有电子配件。
31. What are the patent issues with using lead-free solder?
使用无铅焊料涉及的专利问题有哪些?
32. What are the main qualification tests for using lead-free solder paste?
使用无铅焊锡膏的主要评选测试有哪些?
33. Stir solder paste in container before use.
使用时搅拌容器内的焊膏。
34. Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.
例如，不够充足的焊料，元器件对准不佳、遗漏旁路电容和电源针开路。
35. Separation of the component lead from the solder fillet.
元件面或焊锡面的零件脚旁焊锡裂开。
36. The solder(Deltavave/DeltaMax) can ensure the quality in steady and can solder without lead (Pb) for request of environmental protection.
先进的充氮波峰焊炉，足以确保产品的焊接质量和板面清洁度，提高产品的可靠性和稳定性，并可进行无铅焊接，实现了与国际接轨。
37. Bare laminate, copper, solder resist or other surface.
光面基材，覆铜板，绿油之或其它表面。
38. Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis.
关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析
39. Other effects of lead-free solder paste demolding performance factors such as having a mesh size and aspect ratio.
其它感化无铅焊膏脱模本能机能的成分包含网孔尺寸和宽矮比。
40. The company was founded in 1899 as the Chicago Solder Company to produce flux-cored solder.
凯斯特公司创立于1899年,当时公司名为芝加哥焊锡公司,主要产品是带有焊剂芯的焊锡。
41. Kester has announced that it will open a facility in Nogales, Mexico to meet unprecedented industry demand for its interconnect solder materials.
凯斯特宣布它将在墨西哥Nogales设立工厂以满足互连焊锡膏材料方面的强劲需求。
42. Flux: The material used to remove oxides from metal surfaces and enable wetting of the metal with solder.
助焊剂:用于除去金属表面氧化物并使焊料能润湿金属表面的材料。
43. Is the upper and lower specification limits for individual Solder Paste height measurements also defined?
单点锡膏厚度测量是否定义了其控制上限和下限?
44. Reflow solder paste in 2 hours as soon as possible after printing.
印刷后要在2小时内回流焊膏。
45. The operator should use the solder paste quickly after it has been taken out.
取出的锡膏要尽快实施印刷使用。
46. Atoms in the solder joints move as a result of both diffusion and electromigration.
另一方面，扩散和电迁移效应，则造成焊点中的原子移动。
47. Only partial removal of the contaminated solder pot will get the Pb concentration back below 0.1% wt.
只有将被污染的焊料槽部分取下才可以让铅浓度恢复到重量0.1%以下。
48. The reflow/extraction process should be carried out in accordance with J-STD-004 for the solder preforms.
可以按照针对预焊料的提取的J-STD-004进行回流/提取过程。
49. Available with threaded (-UT), solder (-US), PEX or CPVC connections.
可提供螺纹连接（-UT），焊接连接（-US），PEX或CPVC连接方式。
50. Settable for dipping time. Used solder cup to bring up tin from pot.
可设定焊锡时间,采用子式锡杯,母式锡炉.
51. The liquidus temperature increases with increasing Ag % of the solder.
合金之液相线温度随银含量增加而提高。
52. At the same time,experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
53. Solder Wick: A band of wire removes molten solder away from a solder joining or a solder bridge or just for desoldering.
吸锡带:用以去除焊点,桥接,或脱焊电熔融焊料的线带。
54. As with balling, the solution to solder beading occurring during the RTS profile is to raise the ramp rate until the problem is resolved.
和解决锡球的方法一样，在RTS曲线中将升温斜率适当的升高直到解决问题。
55. Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?
回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?
56. Therefore,it is necessary to study the reliability of this mixed solder joint.
因此,有必要对形成的混合焊点进行可靠性分析。
57. Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
58. Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5，锡高转移的效率与孔面积比率及它对回流峰共面度的影响。
59. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。
60. Is it possible to decrease dross (oxide) generation when using Sn96.5Ag3Cu0.5 Solder?
在使用Sn96.5Ag3Cu0.5焊料时,是否可以降低氮(氧)的产生?
61. At the end of the nineteenth century BCE an ambitious solder called Shamshi-Adad brought Ashur under his control.
在公元前十九世纪末，一位野心勃勃的士兵，名为沙姆希-阿达德，他使亚述在他的控制之下。
62. Flush the line before installing the unit to remove any solder, flux or pipe chips. Clean the strainer every six months or as conditions require.
在安装管接头之前要冲洗管线，清除任何焊料、焊剂或管道碎片。每六个月或根据需要清洗过滤器一次。
63. In the bottom corners I glued two plastic separators so the LCD leans on them and not the solder points.
在底下角落我粘了二个塑料分离器，这样LCD不会倾斜在焊点上。）
64. Q: How do I keep my employees from mixing lead-free and leaded solder and equipment on the line?
在有铅和无铅焊锡混合应用的生产线上，怎样进行设备和物料管理?
65. How do I keep my employees from mixing lead-free and leaded solder and equipment on the line?
在有铅和无铅焊锡混合应用的生产线上，怎样进行设备和物料管理？
66. Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula.
在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命。
67. Remove excess solder with small brush while plastic (soft), leaving a fillet around end of valve as it cools.
在焊接部分成型后，用小刷子清除多余的焊料，使其在焊料冷却后形成一个环绕连接端口的圆角。
68. No-flow underfill materials that cure during the solder reflow process is a relatively new technology.
在精细金属线条的连铸过程中，影响铸件品质的因素很多，所以有必要对不同的操作条件作影响评估。
69. Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.
在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
70. At this stage, it's easy to remake a solder connection if there is a problem.
在这一阶段，如果存在问题，可以很容易地改造焊接的连接点。
71. In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4).
在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
72. In this case the solder pot has to be changed or coated and the solder bar has to be replaced.
在这种情况下,必须更换或涂抹焊料槽,并更换焊料棒。
73. The pads must be clean and free from old solder and flux residue before proceeding with package replacement.
在进行封装器件重贴之前，焊盘必须清洁，没有旧的焊料和焊剂残余。
74. ADJUSTED PRESSURE/TEMPERATURE RATINGS FOR JOINTS MADE OF COPPER TUBE AND SOLDER END VALVES?
在连接铜管和焊接端口阀门时要核对压力/温度额定值?
75. The solder paste may be adaptable to bond kovar and W-Cu materials, kovar and ceramics etc.
在钎焊过程中，镍基板上的镍与钎料中的元素铜存在元素扩散。这对改善钎料与基体之间的结合状况是有益的。
76. The ground solder for the Vrs.
地面焊料的越南难民。
77. What is a good method for solder bar addition for lead-free solder bar?
如何才能很好的为无铅焊料棒添加焊料棒?
78. If you add solder and you can make that circuit substitute for a maze of conventional wiring.
如加上焊料，你就可以使板上面的电路代替那种用旧方法连接起来的迷宫一样的线路。
79. When Cu content of solder is increased, liquidus temperature also rises unfortunately.
如果焊料中的铜含量提高,液相线的温度也会提高。
80. If the Fe concentration increases in the solder pot this indicates that the solder pot is slowly dissolving because of the Pb-free alloy.
如果焊料槽中的铁浓度提高,则表明焊料槽因为无铅合金而缓慢溶解。
