solders

solders

1. The 1710 series threaded and solder end range are "T" pattern globe style valves.

1710系列螺纹和焊接连接端口为T形截止阀结构的阀门。

2. Solder side is chosen to measure.

4量测以吃锡面为选择点。

3. BGA measurement is measured for inside solder point.

BGA量测以最内侧焊点为量测依据。

4. DKL Metals has been one of the UK’s leading suppliers of high purity solders for over 20 years.

DKL金属一直是英国的领先供应商的高纯度焊锡超过20年。

5. Q: Will IPC be publishing a new specification for inspection of lead-free solder joints?

IPC是否会颁布新的关于无铅焊接的质检标准?

6. Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester.

Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。

7. Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester.

Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。

8. RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste.

RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。

9. TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable.

TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。

10. A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.

一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。

11. SMOBC: Solder mask over bare copper.

一种阻焊层覆盖裸铜的工艺。

12. Type of high density solder mask.

一种高密度焊料掩膜。

13. Generally the same fluxes will work for lead-free solder.

一般来说,相同的焊剂用于无铅焊料是有效的。

14. Generally, solder alloys with more than about 8% bismuth will be brittle.

一般来说,铋含量超过8%的焊料合金将会变脆。

15. Generally, the wetting time of solders decreases with increasing temperature, gradually reaching a relatively steady state.

一般来说，焊料的润湿时间随着温度的升高而缩短，并逐渐进入到相对稳定的状态。

16. As early as the Three Kingdom Period, YuanShao, a famous duke, once had millions of solders stationed in Jizhou City in order to fight Caocao, another famous duke.

三国时期袁绍曾于冀州屯兵百万与曹操抗衡，西汉大哲学家、儒家学派一代宗师董仲舒就生于衡水景县。

17. Not all MCMs have Solder Balls or Leads to realize electrical connecting.

不是所有的MCM都采用焊球或引脚和外界相连。

18. Do not solder directly to cells or batteries.

不要直接对电池进行焊接。

19. The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.

不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。

20. Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched.

丝印模板,锡浆网,胶水网

21. Sn-Ag-Cu ternary and Sn-Bi binary alloys are commercial lead-free solders and widely used in electronic industries.

中文摘要银-锡-铜三元合金与锡-铋二元合金为现今工业中常用之无铅焊料。

22. Noctua solders the heat pipes to the cooling fins in order to assist the heat conductivity.

为了更高热传导性能，Noctua对冷却片焊接热管。

23. To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.

为了获得要求的凸起高度，锡膏在晶片焊盘过焊。

24. Solder end valves also available.

也可以提供焊接连接端口的阀门。

25. The amount of refund tax should be consult with the solder .

买单公司的退税金额应该和卖单企业商议。

26. So it will result in rigidity skin &block and solder balls etc.

产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。

27. Discuss the inexorable trend for application of lead-free solders from environmental protection.

从环保角度出发,阐述了无铅钎料使用的必然性。

28. That defect could cause solders to crack and the flight control system to fail, Ernst explains.

他拒绝提供细节，他的观点是，假零件肯定会导致严重事故。

29. It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which cannot corrode carbon steel, stainless steel and solders like tin and lead.

仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、奥氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。

30. It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can't corrode carbon steel, stainless steel and solders like tin and lead.

仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。

31. Very low leakage current, compact, easy to use power entry filter with fast on tabs or solder terminals.

低漏电流,小巧,端子嵌入或焊锡,方便安装和使用。

32. One consequence of using lead-free solders with high tin content is tip erosion, iron tips may require replacement more regularly.

使用具有较高锡含量无铅焊料容易造成烙铁头腐蚀,因而可能需要较为频繁地更换烙铁头。

33. All electronics assemblies using lead in solder.

使用含铅焊料的所有电子配件。

34. What are the patent issues with using lead-free solder?

使用无铅焊料涉及的专利问题有哪些?

35. What are the main qualification tests for using lead-free solder paste?

使用无铅焊锡膏的主要评选测试有哪些?

36. Stir solder paste in container before use.

使用时搅拌容器内的焊膏。

37. Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.

例如，不够充足的焊料，元器件对准不佳、遗漏旁路电容和电源针开路。

38. Separation of the component lead from the solder fillet.

元件面或焊锡面的零件脚旁焊锡裂开。

39. Bare laminate, copper, solder resist or other surface.

光面基材，覆铜板，绿油之或其它表面。

40. There are concerns to be addressed with component and board finish compatibility with lead-free solders.

关于无铅焊料,在元器件和线路板终饰兼容性方面有几个人们关心的问题需要予以说明。

41. Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis.

关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析

42. The requirement of the cleaning level is more than the water on metal, for there must be close bonding between solders and metals.

其清洁水准的要求比水于金属板上还要高很多，因为焊锡和金属之间必需是紧密的连接。

43. Officers: These are the more experienced and highly trained solders in your army.

军官：它们是你的军队中富有经验的受过良好训练的士兵。

44. The company was founded in 1899 as the Chicago Solder Company to produce flux-cored solder.

凯斯特公司创立于1899年,当时公司名为芝加哥焊锡公司,主要产品是带有焊剂芯的焊锡。

45. The dynamic compressive properties of Sn-Ag Pb-free solders have been studied by means of a split Hopkinson pressure bar at high strain rates.

利用分离式霍普金森压杆试验技术,在室温下研究了锡-银系无铅焊料在高应变率条件下的动态压缩力学性能。

46. By noontime the soldiers' clothes were wet through with sweat, and the marching speed slowed down.Some solders of weak physique even fainted on the roadside.

到了中午时分，士兵的衣服都湿透了，行军的速度也慢下来，有几个体弱的士兵竟晕倒在路边。

47. Flux: The material used to remove oxides from metal surfaces and enable wetting of the metal with solder.

助焊剂:用于除去金属表面氧化物并使焊料能润湿金属表面的材料。

48. Washington wants Japan to dispatch solders to the war in Afghanistan.

华盛顿希望日本为阿富汗战争派遣自卫队员，

49. Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?

50. Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏。

51. The operator should use the solder paste quickly after it has been taken out.

取出的锡膏要尽快实施印刷使用。

52. Describes the advantages of the jointly-designed three-chamber vacuum brazing furnace and the construction of vacuum mup and solders used for it.

叙述了真空保温杯的种类,保温时间及使用寿命,联合设计三室真空钎焊炉的优点以及真空杯的钎焊焊料、结构。

53. Atoms in the solder joints move as a result of both diffusion and electromigration.

另一方面，扩散和电迁移效应，则造成焊点中的原子移动。

54. Only partial removal of the contaminated solder pot will get the Pb concentration back below 0.1% wt.

只有将被污染的焊料槽部分取下才可以让铅浓度恢复到重量0.1%以下。

55. Available with threaded (-UT), solder (-US), PEX or CPVC connections.

可提供螺纹连接（-UT），焊接连接（-US），PEX或CPVC连接方式。

56. Settable for dipping time. Used solder cup to bring up tin from pot.

可设定焊锡时间,采用子式锡杯,母式锡炉.

57. The liquidus temperature increases with increasing Ag % of the solder.

合金之液相线温度随银含量增加而提高。

58. At the same time,experiments on PBGA solder ball laser reflow were carried out.

同时，本文还对PBGA钎料球激光重熔进行了试验研究。

59. Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?

回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?

60. Therefore,it is necessary to study the reliability of this mixed solder joint.

因此,有必要对形成的混合焊点进行可靠性分析。

61. Therefore, it is necessary to study the reliability of this mixed solder joint.

因此，有必要对这种混合焊点进行可靠性分析。

62. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.

在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。

63. Is it possible to decrease dross (oxide) generation when using Sn96.5Ag3Cu0.5 Solder?

在使用Sn96.5Ag3Cu0.5焊料时,是否可以降低氮(氧)的产生?

64. At the end of the nineteenth century BCE an ambitious solder called Shamshi-Adad brought Ashur under his control.

在公元前十九世纪末，一位野心勃勃的士兵，名为沙姆希-阿达德，他使亚述在他的控制之下。

65. Q: How do I keep my employees from mixing lead-free and leaded solder and equipment on the line?

在有铅和无铅焊锡混合应用的生产线上，怎样进行设备和物料管理?

66. How do I keep my employees from mixing lead-free and leaded solder and equipment on the line?

在有铅和无铅焊锡混合应用的生产线上，怎样进行设备和物料管理？

67. Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula.

在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命。

68. Remove excess solder with small brush while plastic (soft), leaving a fillet around end of valve as it cools.

在焊接部分成型后，用小刷子清除多余的焊料，使其在焊料冷却后形成一个环绕连接端口的圆角。

69. Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.

在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。

70. At this stage, it's easy to remake a solder connection if there is a problem.

在这一阶段，如果存在问题，可以很容易地改造焊接的连接点。

71. There is few solders alived in this battle.

在这场战役中只有少数士兵幸存下来.

72. In this case the solder pot has to be changed or coated and the solder bar has to be replaced.

在这种情况下,必须更换或涂抹焊料槽,并更换焊料棒。

73. The pads must be clean and free from old solder and flux residue before proceeding with package replacement.

在进行封装器件重贴之前，焊盘必须清洁，没有旧的焊料和焊剂残余。

74. ADJUSTED PRESSURE/TEMPERATURE RATINGS FOR JOINTS MADE OF COPPER TUBE AND SOLDER END VALVES?

在连接铜管和焊接端口阀门时要核对压力/温度额定值?

75. The solder paste may be adaptable to bond kovar and W-Cu materials, kovar and ceramics etc.

在钎焊过程中，镍基板上的镍与钎料中的元素铜存在元素扩散。这对改善钎料与基体之间的结合状况是有益的。

76. The ground solder for the Vrs.

地面焊料的越南难民。

77. The solders put up a fight against the enemy's attack.

士兵们奋力抵抗敌人的进攻。

78. What is a good method for solder bar addition for lead-free solder bar?

如何才能很好的为无铅焊料棒添加焊料棒?

79. If you add solder and you can make that circuit substitute for a maze of conventional wiring.

如加上焊料，你就可以使板上面的电路代替那种用旧方法连接起来的迷宫一样的线路。

80. When Cu content of solder is increased, liquidus temperature also rises unfortunately.

如果焊料中的铜含量提高,液相线的温度也会提高。