underfill
underfill
1. Discuss the necessary of flip chip underfill to ther mal fatigue failures.Put forward controlling parameter for flip chip underfill.
[摘要]从热疲劳故障的角度论述了倒装芯片底部填充的必要性 ，介绍了倒装芯片底部填充的参数控制。
2. underfill materials；
下填料；
3. This thesis is focus on the problem of warpage in flip-chip package due to the CTE mismatch between die, substrate, and bump using various underfill materials.
中文摘要本论文针对覆晶封装制程中，因为晶片、基板、凸块和底胶材料都之不同，当温度变化时，所产生的热膨胀效应使得整个封装出现翘曲变形的现象。
4. For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package.
为避免覆晶封装结构中使用底胶填充之限制，且同时保有良好的可靠性，本文提出无底胶附加限制层覆晶封装结构的新概念。
5. Underfill Delamination of Flip Chip on Low-Cost Board
低成本基板倒装焊底充胶分层裂缝扩展研究
6. The forming process of 6400 steering knuckle arms was analyzed by plastic FEM software Deform. The reasons causing the problems of fold and underfill in the production were found.
使用塑性有限元分析软件deform对 640 0转向节臂成形过程进行了模拟分析 ,找出了其在生产过程中出现的折叠、缺肉等问题的原因。
7. Pot life is the useful life of an underfill encapsulant after it is removed from the freezer and thawed, typically determined by the ability to dispense uniform quantities at uniform speeds.
使用寿命是指底部填充剂从冷冻条件下取出后可有效使用的时间。有效使用是指在一定的点胶速度下可保证的点胶量的连续性及一致性。
8. An integrated circuit, for example, may consist of a silicon die, die attach material, epoxy underfill, mould compound, leads, and lead plating materials.
例如一个集成电路芯片的组成由硅基模，模固定材料，环氧树脂填充物质，模压成分，导线，导线镀层材料。
9. Keywords flip chip;underfill;interfacial delamination and crack propagation;finite element simulation;fracture mechanics.;
倒装焊;底充胶;界面分层与裂缝扩展;有限元模拟;断裂力学;
10. Thermal Cycle Failure of SnPb Solder Joint for Flip Chip Package and Effects of Underfill Material
倒装焊SnPb焊点热循环失效和底充胶的影响
11. Research of underfill delamination of flip chip
倒装焊电子封装底充胶分层研究
12. Flip chip;interface adhesion;coefficient of thermal expansion;underfill;interface crack;energy release rate
关键词:覆晶构装;界面黏著度;热膨胀系数;底填胶;界面裂缝;能量释放率
13. Keywords: flip-chip technology；solder joint reliability；FEM；solder joint height；underfill materials； strain；stress
关键词：倒装焊技术；焊点可靠性；有限元法；焊点高度；下填料；应变；应力
14. CTE mismatch between silicon and BT board is so colossal that flip chip need filling underfill to keep the long-term reliability.
因覆晶封装结构中的矽晶片与有机基板间的热膨胀系数差异颇大，故需填充底胶以确保其长时可靠性。
15. Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
16. No-flow underfill materials that cure during the solder reflow process is a relatively new technology.
在精细金属线条的连铸过程中，影响铸件品质的因素很多，所以有必要对不同的操作条件作影响评估。
17. It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling.
它能形成一致和无缺陷的底部填充层，能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击。
18. Keywords thermal conductivity;micro-electronic packaging;composite epoxy;underfill;flip chip;
导热系数;微电子封装;复合材料;底充胶;倒装焊;
19. The P-V-T-C equation of underfill encapsulant was developed by employing the thermal analyzer and statistical technique.
并且配合统计的技巧建立出一个压力-体积-温度-熟化度的关系式(P-V-T-C关系式)。
20. The influence of underfill and its material models on the reliability of flip chip package under thermal cycling
底充胶及其材料模型对倒装焊热循环可靠性的影响
21. Thermal conductivity prediction of underfill and its affects on the flip chip temperature field
底充胶导热系数预测及对倒装焊温度场的影响
22. underfill materials
底部填充料
23. In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and 3D mold flow simulation.
文中主要探讨了覆晶封装底胶充填时,锡球、芯片及基板间的流动状况。
24. New Underfill Technology Application and Development
最新底部填充技术的应用及发展
25. Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
26. In-Line System for Underfill Adhesive and Encapsulation
流水线设备
27. Keywords Solder joint reliability, flip-chip on board, underfill, delamination,,,,,crack;
焊点可靠性;基板倒装焊;底充胶;分层;裂纹;
28. Moreover, underfill is usually thermosetting polymer and the process of hardening is time-consuming.If the die is found it cannot work after baking of underfill, the die cannot be replaced.
然因底胶通常为热固性的高分子聚合物，不仅固化过程过于耗时，同时经过烘烤固化后若发现晶片功能出现瑕疵，将无法进行重工。
29. However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated.
然由于晶圆级构装不填注底胶，因此当晶圆级构装于组装PCB基板后承受热循环负载时，焊锡接点可靠度已成为构装结构主要可靠度问题之一。
30. The die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.
用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。
31. MATERIAL MODELS FOR SnPb SOLDERS AND UNDERFILL IN ELECTRONIC PACKAGING AND THEIR APPLICATION
电子封装SnPb钎料和底充胶的材料模型及其应用
32. DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
简介：道尔DU901是一种单组分环氧密封剂，用于CSP或BGA底部填充制程。
33. The results show that,in the mechanical bend fatigue test and three point bend test,the underfill material of U1 and U2 both can improve the mechanical bend reliability of BGA assemblies,and U1 material performs better.
结果发现在机械弯曲可靠性试验中,U1、U2材料的填充均能提高焊点的机械弯曲可靠性,并且U1的效果更好。
34. The results show that the residual moisture within underfill materials enhances the stress level in solder joint.
结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
35. Fat good, original poor clever boy with respect to underfill, if seek a fat wife, that as it happens before short jin be short of the flesh of two to fill neat, god is balance of one lever fairness.
胖好呀，本来瘦猴就缺肉，如果找个胖老婆，那正好把以前短斤缺两的肉都补齐了，老天爷就是一杆公平秤呢。
36. Flip Chip and CSP Underfill
芯片导电胶
37. Flow Visualization for Underfill Encapsulation of Flip Chip
覆晶封装底胶充填流动研究
38. This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.
这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。
39. T hen show that correct underfill can dramatically increase thermal reliability.
通过正确的底部填充，可提高倒装芯片组装的成品 率和可靠性。
40. First, the reaction kinetics and isothermal conversion of underfill was determined by employing DSC and a statistical technique.
首先，利用微差扫描热卡计(DSC)配合统计之技巧来求得底胶材料之反应动力学模式。
